Method and apparatus for calibrating a thermistor

ABSTRACT

The presently described embodiments are directed to a calibration method and system for thin film thermistors that are locally heated with integrated thin film heaters. Initially, print head temperature is either measured or referenced. Then, transient thermistor resistances are measured and used to determine the thermistor resistance at a higher temperature. Notably, this calibration method is advantageously implemented as a step of an existing process without having to expose the print heads to operating temperatures. In some implementations of the presently described embodiments, trimming of the thermistors may be required once calibrated.

BACKGROUND

The present exemplary embodiment relates to a method and apparatus forcalibrating a thermistor. It finds particular application in conjunctionwith thermistors used in liquid drop ejectors such as print headsoperative to emit phase change ink, and will be described withparticular reference thereto. However, it is to be appreciated that thepresent exemplary embodiments are also amenable to other likeapplications.

By way of background, thermistors are often used on print heads tocontrol temperature. In an effort to reduce cost and improve temperaturecontrol response, thermistors are deposited and patterned on a printhead using thin-film or thick-film processes. Such a configuration isdisclosed in co-pending and commonly assigned U.S. application Ser. No.______, filed ______, entitled “Thin Film and Thick Film Heater andControl Architecture for a Liquid Drop Ejector” and having Michael Younget al. named as inventors (Applicant Docket No. 20031641-US-NP; AttorneyDocket No. XERZ 2-00753), which application is hereby incorporated byreference herein.

When thin film fabrication is implemented, however, process variationsof +/−10% in the sheet resistance and the temperature coefficient ofresistance (TCR) are typical. This can result in large temperaturemeasurement errors. Of course, accuracy and precision in temperaturemeasurement is important for print head control and maintenance. Thus,to overcome this potential measurement error, every thermistorfabricated using thin-film techniques should be calibrated at theoperating temperature of the print head. To do so, each print head mustbe brought to its operating temperature by external heating means. Thismay include the use of a heated chuck and a heated air gun, for example.Other methods may include adjusting a heater control unit until a properdrop mass is achieved. These approaches, though, result in excessivecost in terms of time and resources. Therefore, a low cost calibrationmethod is needed.

Likewise, because of the thin film fabrication variations of +/−10% insheet resistance and temperature coefficient of resistance (TCR), thinfilm thermistors may also need to be trimmed. The current industrymethod of trimming thin film thermistors is expensive. Therefore, asimple low-cost and manufacturable method for trimming thin-filmthermistors is desired.

A variety of prior patents address calibrating and trimming thermistors.For example, U.S. Pat. No. 5,881,451, entitled “Sensing the temperatureof a printhead in an ink jet printer,” issued on Mar. 16, 1999. Thispatent describes a temperature compensation method for TCR variation butit assumes that TCR variation data is available for trimming.

U.S. Pat. No. 5,315,316, issued May 24, 1994, is entitled “Method andApparatus for Summing Temperature Changes to Detect Ink Flow.” Thispatent describes a print head temperature control circuit which includesa temperature sensor formed on the printhead substrate. The ink drop ismeasured and temperature is adjusted to the correct ink drop.

U.S. Pat. No. 5,075,690, issued Dec. 24, 1991 and entitled “TemperatureSensor for an Ink Jet Print Head” describes an analog temperaturesensor. A more accurate response is achieved by forming the thermistoron the printhead substrate of the same polysilicon material as theheaters. The thermistor is calibrated and trimmed at the operatingtemperature.

U.S. Pat. No. 5,428,206, issued Jun. 27, 1995 and entitled “PositiveTemperature Coefficient Thermistor Heat Generators” describes theimplementation of a positive temperature coefficient (PTC) thermistor inparallel with a series combination of a high output foil heater and abimetal switch. The bimetal switch opens when a desired temperature isreached. The positive temperature coefficient (PTC) thermistorpurportedly maintains the heated object's temperature when the foilheater is switched off.

U.S. Pat. No. 5,406,361, entitled “Circuit for controlling Temperatureof a Fuser Unit in a Laser Printer,” issued on Apr. 11, 1995. Thispatent describes a circuit which compares first reference voltage,associated with an operational temperature (200 C), and second referencevoltage, associated with a standby temperature (150 C), to a sensordependent voltage for laser printer fuser temperature regulation. Thesensor measures the temperature of the laser printer's fuser unit andthis information was used to control the fuser heating unit. Negativetemperature coefficient (NTC) thermistors are used. The circuit usesanalog comparators and thus does not involve using A/D conversion andextra CPU clock cycles.

BRIEF DESCRIPTION

In accordance with one aspect of the present exemplary embodiments, themethod comprises first measuring a first resistance of the thermistor ata first temperature, heating the thermistor, second measuring atransient resistance response of the thermistor through a range ofvarying temperatures, generating a plot of thermistor resistance againstthermistor temperature based on the first and second measuring andcalculating an operating temperature resistance based on the plot.

In accordance with another aspect of the present exemplary embodiments,the heating comprises applying a constant voltage.

In accordance with another aspect of the present exemplary embodiments,the method further comprises trimming the thermistor based on theoperating temperature resistance.

In accordance with another aspect of the present exemplary embodiments,the method comprises first measuring a first resistance of thethermistor at a first temperature, heating the thermistor, secondmeasuring a transient resistance response of the thermistor over time,generating a plot of thermistor resistance against thermistortemperature based on the first and second measuring and temperatureprofile data and calculating an operating temperature resistance basedon the plot.

In accordance with another aspect of the present exemplary embodiments,the heating comprises applying a constant power.

In accordance with another aspect of the present exemplary embodiments,the method further comprises trimming the thermistor based on theoperating temperature resistance.

In accordance with another aspect of the present exemplary embodiments,a means is provided to implement the methods.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of an example droplet ejector to which thepresently described embodiments may be applied or into which thepresently described embodiments may be incorporated;

FIG. 2 is a partial top view of the droplet ejector of FIG. 1;

FIG. 3 is a cross-sectional view of a portion of the droplet ejector ofFIG. 1;

FIG. 4 is a flowchart illustrating a method according to the presentlydescribed embodiments;

FIG. 5 is a graph of data obtained in implementation of the presentlydescribed embodiments;

FIG. 6 is a graph of data obtained in implementation of the presentlydescribed embodiments;

FIG. 7 is a flowchart illustrating a method according to the presentlydescribed embodiments;

FIG. 8 is a graph of data obtained in implementation of the presentlydescribed embodiments;

FIG. 9 is a graph of data obtained in implementation of the presentlydescribed embodiments;

FIG. 10 is a trimming network according to the presently describedembodiments; and;

FIG. 11 is a table having values used in connection with the presentlydescribed embodiments.

DETAILED DESCRIPTION

The presently described embodiments are directed to a calibration methodand system for thin film thermistors that are locally heated withintegrated thin film heaters. This presently described technique(s)results in high heating efficiency. Initially, print head temperature iseither measured or referenced. Then, transient thermistor resistancesare measured and used to determine the thermistor resistance at a highertemperature. Notably, this calibration method is advantageouslyimplemented as a step of an existing process without having to exposethe print heads to operating temperatures. Thus, calibration accordingto these presently described embodiments will be virtually transparentto the process, with virtually no added costs of time or resources.

In some implementations of the presently described embodiments, trimmingof the thermistors may be required once calibrated. Trimming thermistorstypically requires changing the fabricated resistance to a setresistance value. In the presently described embodiments, selective wirebonding is used rather than laser trimming parallel lines. A set of bondpads are disposed in series where each bond pad adds to the totalresistance of the thermistor. Depending on how much resistance needs tobe added, the correct bond pad(s) can be programmed to be wired. Thiswill result in the desire calibrated thermistor resistance withoutadditional throughput time, process step, and equipment cost.

With reference to FIG. 1, a liquid drop ejector 200 is shown. Thisexemplary drop ejector will typically include variations of +/−10% withrespect to resistance and temperature coefficient of resistance. Such avariation is typical, as noted above. This is significant becausethermistor resistance as a function of temperature is controlled by thefollowing relationship, R(T)=Ro(1+aΔT) where “a” is the temperaturecoefficient of resistance (TCR), Ro is the resistance at temperature Toand ΔT is the difference between temperature T and temperature To.Accordingly, these variations result in varying thermistor resistancefrom print head to print head.

As noted, the problem might be addressed by fabricating thermistors withvery small variations in resistance and in temperature coefficients ofresistance. However, this approach is not practical. Another solution tothe problem would be to determine the resistance at the actual operatingtemperature for each print head and simply trim the thermistor. However,as noted above, this is also not feasible. As such, the presentlydescribed embodiments—which include an approach whereby the thin filmthermistor is calibrated without any additional process steps and, insome cases trimmed—is advantageously implemented.

In this regard, the liquid drop ejector 200 includes a jet stack 202having a pixel zone 204 disposed therein. The jet stack is, in one form,made from layers of stainless steel that are configured to form inkchannels and orifices for ejecting ink. One side of the jet stack servesas the jetting side (from where the ink is ejected) while the oppositeside serves as the actuator side (having the actuating elementsconnected thereto). In FIG. 1, the actuator side is shown.

The pixel zone 204 comprises pixel elements (shown, for example, at 206)arranged in columns and rows on a surface of the jet stack 202. Thispixel zone is disposed in the substantially center portion of the jetstack 202. For manufacturing purposes, a mesa is optionally formed onthe surface of the jet stack and protrudes to allow for properattachment of a metalized actuator element. This metalized actuatorelement is not shown. Moreover, it should be understood that the pixelelements 206 are driven by a driver chip in a range of approximatelyminus 40 volts to plus 40 volts. Each pixel element 206 is electricallyconnected to an input/output (or bond) pad (described below) forcommunication to these driver chips (not shown). The driver chips resideon a PCB with circuitry layer, i.e., a rigid printed circuit board,which is attached to the liquid drop ejector that house the actuatorelement that provide the forces to eject the ink. The drive signals arerouted on the jetstack surface coplanar to the heater elements. Thesedrive signal and heater element I/O pads are wire bonded to the rigiddriver chip printed circuit board.

Thin film or thick film heater elements 208 are provided to columns ofthe pixel elements within the pixel zone. The heater elements 208 withinthe pixel zone 204 loop around columns of pixels 206 in the pixel zone204. The liquid drop ejector 200 includes temperature sensors orthermistors 210 and 212, as well as additional heater elements 214 and216 which lie outside the pixel zone. The thermistors may include two orfour terminal for input/output functions. Still further heating elementsmay be formed on the liquid drop ejector (e.g., near ink feed ports andbond pads) to improve watt density distribution. As alluded to above,bond pads 218 and interconnect lines 220 are also formed on the jetstack. Note that, for ease of circuit connection, these pads are locatedon the same edge of the jet stack. It is also notable that theinterconnect lines 220 are fanned out from the bond pads as illustratedto accommodate ink feed manifold ports 222 which are positioned on theliquid drop ejector 200. This configuration of fanning out the linesalso allows for improved heat dissipation. In one form, the lines may bedisposed at an angle from the perpendicular. This range will allowconvenient access to all pixel element rows and columns.

It should be further noted that the interconnect lines 220 take twoforms: heater lines and signal lines. The heater lines extend from thebond pads 218, as loops, around columns of pixel elements 206. Thesignal lines (not specifically shown) extend from appropriate bond pads218 to corresponding pixel elements for control purposes. As shown, bothtypes of lines are present in the fanned-out portions of interconnectlines 220 shown in FIG. 1.

With reference now to FIG. 2, an end of the print head 200 is shown. Asillustrated, the end heater 214 is shown as encompassing the thermistor210. Also shown is the bond pad area 218. This example configuration isconducive to a useful calibration system configuration, although otherconfigurations may be implemented in connection with the presentlydescribed embodiments. Such configurations will depend on a variety offactors but should, nonetheless, achieve the objectives of the presentlydescribed embodiments.

In the configuration of at least one of the presently describedembodiments, the only additional measurement taken during the probingand testing stage of the processing of the print head will be themeasurement of resistance under temperature values according to thedescription herein. The increased time to accomplish this task willlikely be minimal compared to the overall probing and testing timerequired for the print head. With this in mind, the configuration ofFIG. 3 illustrates a cross-sectional view of the print head and the thinfilm layers along with suitable set-up hardware. Note that a probe tip300 is used to engage the bonding pad 218. The probes are applied to thebond pads in this manner to suitably power the heater and measure thethermistor resistance. In addition, a single thermocouple, eitherthermocouple 302 or thermocouple 304, is attached to the front side orback side of the print head, respectively. As shown, the front sidethermocouple 302 is attached directly to the thermistor 210. The backside thermocouple 304 is positioned to take its measurement through theprint head 200. Also shown is a probe station controller(s) 306, whichmay be one or many controllers. This hardware configuration issignificantly less expensive and more simplified than the experimentalmechanisms that were heretofore known.

To make the thermistor calibration process transparent to themanufacturing process, the thermistor calibration process should beincorporated into existing processes that are performed on the printhead during its manufacture and set-up. As such, the presently describedembodiments implement the calibration process during the probe and testphases of the print head preparation process. Because every print headis electrically probed for defects, such as open circuits, bridges,short and short circuits, the probe and test stage is an advantageousopportunity to perform the calibration process according to thepresently described embodiments. In this manner, no additional probecards or equipment is needed. The existing probe station can be used tomeasure resistances at various temperatures and, since throughput timeneeds to be short compared to overall probe time, the method ofcalibration according to the present application is desired and useful.

In operation, the calibration method utilizes an existing thin filmheater(s), such as thin film heater 214, to locally heat the thermistor,such as thermistor 210. This has been found to be the most efficientmanner of heating the thermistors, although other methods such as theuse of a heated chuck or localized hot gas could be used so long as theobjectives of the presently described embodiments are achieved. As isapparent from FIGS. 2 and 3, the heaters and thermistors are in closeproximity to one another and, in other forms, may be intertwined forbetter localized heating and response. Likewise, the bond pads are inclose proximity to the thermistors and are located near the bottom ofthe print head for convenient probe card access.

The presently described embodiments contemplate at least two methods ofdetermining resistance at the operating temperature of the print head.As such, two separate methods of thermistor calibration will bedescribed. In this regard, the first described method involves theapplication of a constant voltage to the configuration and a continuedmeasurement of temperature and resistance. The obtained data is thenused as a basis to calibrate the thermistor. In the second describedmethod, a constant power is applied to the configuration and resistanceis measured. Based on the resistance data obtained and a referencetemperature, the thermistor is calibrated.

It should be understood that the methods described herein may beimplemented at the probe station where testing and probing of theejector device would typically occur. As such, the routines that areimplemented to assist in the calibration and, in some cases, trimmingare stored in suitable memory locations and are run by processors orprobe station controller(s), such as probe station controller(s) 306,that may form a part of the probe station or be added to the station. Itwill be understood by those skilled in the art that the probe stationmay take a variety of forms and that the routines noted above may beimplemented using a variety of hardware configurations and softwaretechniques.

More specifically, with reference now to FIG. 4, a method 400 isillustrated. Using this method, an initial heater resistance andthermistor resistance is measured at a set temperature, e.g. roomtemperature, using a variety of terminal measurements (at 402). In oneform, four terminal measurements are taken to obtain this data. Next, aconstant voltage is applied to the test probe (at 404). Thus, the inputpower to each print head will be different, given that the print headsvary in resistance values, as noted above.

While applying the constant voltage, transient temperature is measuredwith either a thermocouple on the probe card or in a probe station chuck(at 406). In this regard, the thermocouple will make contact with eitherthe thermistor, e.g. as does example thermocouple 302 of FIG. 3, or anopposite side of the print head corresponding to the thermistor, e.g. asdoes example thermocouple 304 of FIG. 3. During this process, thetransient resistance response of the thermistor is also measured inmanners that are well known such as through the test probe (at 408).

The temperature and resistance is then plotted in one form of thepresently described embodiments (at 410). From this plot, the resistancefor a higher temperature, e.g., the operating temperature, can becalculated (at 412). Of course, because the relationship of temperatureversus resistance is generally linear, a simply extrapolation can beused to calculate the appropriate resistance value at the operatingtemperature. Moreover, depending on the mathematical processing schemesthat may be used, an actual plot may not be necessary.

The calculated value can then be used to trim the resistor at a laterprocess step or be stored in memory for use as a set point value (at414).

The plots of FIGS. 5 and 6 illustrate and validate the implementation asdescribed herein. As such, referring to FIG. 5, a temperature plot 502and resistance plot 504 as functions of time are illustrated for asingle example droplet ejector. This data is that which is gathered in,for example, 406 and 408 and is then used to plot a temperature versusresistance graph of FIG. 6, e.g. as in 410. As shown, the relationshipbetween these two variables is substantially linear. The data that wasobtained (e.g. the data in FIG. 5), is shown in FIG. 6 at 602. Alsoshown in FIG. 6 is data 604 that is extrapolated to calculate theresistance values at the operating temperature, e.g. as in 412 above. Asshould be understood, the extrapolation is relatively straight-forwardin this case based on the fact that the relationship is linear. In thisexample, the calculated or extrapolated value is 2820 ohms, while theactual value (measured by bringing the printhead to actual operatingtemperature) is 2817 ohm.

With respect to the second method noted above, referring now to FIG. 7,a method for thermistor calibration 700 is illustrated. In this method,again, the heater resistance and thermistor resistance at a specifiedtemperature, such as room temperature, is measured (at 702). Typically,four terminal measurements are used to obtain this data. Using initialheater resistance information, a set or constant power level is appliedto the heater, e.g., heater 214 (at 704). It should be understood, thatin this method, the applied power will be identical for all print heads.The current and voltage will be adjusted to maintain a constant powerinput throughout the heating process. In one form, the voltage isvariable and the current is held constant. This will account for anyheating variations due to heater line width, thickness and temperaturecoefficient of resistance variations.

During application of the constant power, the transient resistanceresponse of the thermistor is measured using known techniques (at 706).Using a reference temperature response, temperature versus resistance isplotted (at 708). This is accomplished, in one form of the presentlydescribed embodiments, using a table look up. The table stores data onpower levels and corresponding resistance and temperature values. Thereference temperature is used to obtain data to generate a slope. Thisslope, coupled with the initial resistance value, e.g. the resistancevalue measured at room temperature at 702, allows for the plotting of aline, representing the linear relationship between the temperature andresistance values for the thermistor being calibrated. Then, aresistance value for a higher temperature, such as the operatingtemperature, is calculated based on a plot (at 710). As expected, thiscalculated may be a simple extrapolation. Lastly, the resistance valuethat is calculated may be used to trim the resistor during a laterprocess step or it can be stored in a memory as a set point value (at712).

This process relies on the phenomenon that temperature profiles of thethermistors for a given power level are relatively constant. This isillustrated in FIG. 8 wherein a plurality of profiles 802, correspondingto a plurality of thermistors, is illustrated. As shown, the profilesare consistent.

As with the first method described above, the experimental resultsillustrate the effectiveness of the system. For example, referring nowto FIG. 9, a graph 900 illustrates the measured and calculated plots orlines 902 and 904. These lines are extrapolated out to 906 and 908,respectively. As shown the extrapolated values are 2821 ohms and 2749ohms for two different ejectors. The actual values for those devices are2817 ohms and 2745 ohms. It is noted that the data presented in FIGS. 8and 9 is data obtained using the front side of the ejector. In caseswhere data is obtained from the back side of the ejector, varyingresults should be expected.

Using either method, a low cost calibration method is realized. The datacan be collected during probing and testing with minimal process timeand no added costs. The thermistor can be locally heated using the thinfilm heaters already present on the print head and the transientresponse can be used to determine the operating thermistor resistance.As such, expected and known variations of the thin film processing ofprint heads can be accounted for in a simple and a low cost method tocorrect for such variations as realized. In this process, thermistorsresistances at high operating temperatures can be determined from usinglow temperature readings. Because of the simple calibration technique, abroad range of process variations can be addressed.

As noted above, once the thermistor is calibrated, there are situationswhere trimming is accomplished. In order to make thermistor trimmingtransparent to the manufacturing process, it too needs to beincorporated into an already existing process.

The presently described embodiments propose trimming the thermistorusing selective wire bonding. Since every droplet ejector will be wirebonded, separate programs can be used to wire bond the specific bondpads to get the desired total resistance. A sample layout 1000 is shownin FIG. 10. This layout would, in one form, be provided in a suitablelocation on the ejector in proximity to the bond pads.

As illustrated, there are 12 bond pads 1002, labeled 1-12. Pads 1-6 aredesignated for one wire bond and pads 7-12 are designated for the otherwire bond. Since there are typically two wire bonds for the thermistor,one side will have increments of five 20 ohm pads, and the other five100 ohm pads. These resistance values are measured at room temperatures.The total range that can thus be trimmed will be 600 ohms with 200 ohmprecision. Alternative layouts can also be used for more precisiontrimming with 10 ohm accuracy. In addition, the resistors 1004, e.g.having R1 and R2, will be measured during probe for more accuratetrimming.

An example implementation is illustrated in connection with FIG. 11,having a table 1100 depicted. Wire bond information for differentejectors PHs 56, 57, 59, 60, 69, and 70 populated the table 1100. In oneform of the described embodiments, the wire bond left and right numberscan be used to designate a wire bonding recipe. There will be 72different recipes. Thus, when an ejector is loaded onto a bonder, theoperator will input the ejector number and the computer (e.g.controller(s) 306 of FIG. 3) will download the appropriate recipe. Inmanufacturing situations, it is advantageous to download the recipe froma computer in order to avoid any operator error. By entering the IDnumber, accountability can be established and the correct recipe can beused.

An automated process is contemplated by these trimming techniques. Inthis regard, a computer program or controller (e.g. controller(s) 306 ofFIG. 3) may determine which bond pads to wire bond from the calibratedthermistor data. This can be accomplished using suitable routines storedin the controller. A bonding recipe that is unique to the lot number isassigned and stored in a database based on the determinations of thecontroller. When the lot number is entered into the bonder by anoperator, the bonder retrieves the recipe and implements the appropriatetrimming.

The exemplary embodiment has been described with reference to thepreferred embodiments. Obviously, modifications and alterations willoccur to others upon reading and understanding the preceding detaileddescription. It is intended that the exemplary embodiment be construedas including all such modifications and alterations insofar as they comewithin the scope of the appended claims or the equivalents thereof.

1. (canceled)
 2. (canceled)
 3. (canceled)
 4. A method for calibrating athermistor in a liquid drop ejector, the method comprising: firstmeasuring a first resistance of the thermistor at a first temperature;heating the thermistor; second measuring a transient resistance responseof the thermistor over time; generating a plot of thermistor resistanceagainst thermistor temperature based on the first and second measuringand temperature profile data; and, calculating an operating temperatureresistance based on the plot.
 5. The method as set forth in claim 4wherein the heating comprises applying a constant power.
 6. The methodas set forth in claim 4 further comprising trimming the thermistor basedon the operating temperature resistance.
 7. (canceled)
 8. (canceled) 9.(canceled)
 10. A system for calibrating a thermistor in a liquid dropejector, the system comprising: means for first measuring a firstresistance of the thermistor at a first temperature; means for heatingthe thermistor; means for second measuring a transient resistanceresponse of the thermistor over time; means for generating a plot ofthermistor resistance against thermistor temperature based on the firstand second measuring and temperature profile data; and, means forcalculating an operating temperature resistance based on the plot. 11.The system as set forth in claim 4 wherein the means for heatingcomprises applying a constant power.
 12. The system as set forth inclaim 4 further comprising means for trimming the thermistor based onthe operating temperature resistance.